KITECH

KITECH USA Technology Cooperation Office organized the Korea-USA Silicon Valley Electronics Packaging Technology Exchange Seminar on February 19 at Mission City Center Conference room(USA). The seminar was focused on establishment of industrial technology expert network and the promotion of joint technology development .

 'Next generation Packaging Process using Nano Composite Solder presented by Dr. Se-Hoon Yoo(Advanced Welding & Joining Technology Center) and 'Welded materials for next generation electric packaging' presented by Dr. Jun-Ki Kim(Advanced Welding & Joining R&D Department) received special attention.